PCB Manufacturing

China Wintech, Multilayer Rigid PCB, High Difficulty & High-Density Interconnect HDI PCB, Microvia,RF, Every Layer InterConnect ELIC PCB, Flexible Printed Circuits, HDI Rigid-Flex Circuits, Semi-flex circuits, FPC, Pcb, China Printed Circuit Boards Assembly Design & Layout, Quick Turn Prototype, Rapid Fast Prototyping, Mass Manufacturing China PCB fabrication, Suppliers manufacturer Companies.

Wintech is one of the world's leading China Printed Circuit Boards Assembly manufacturer. Wintech provides 2-70 layered PCBs for design and China PCB fabrication, including HDI, Rigid, Rigid-Flex, & flex boards. Quantities range from prototype to mass production, with high quality, and quick turn available at an excellent cost. We are one of the top leading PCB fabricators in China because we adhere strictly to manufacturing rules to maintain quality control.

Over 20 Years of Experience in China Printed Circuit Boards Assembly Manufacturing, 350,000ft2 monthly | Our products are UL- and RoHS-marked | 2-70 Layer Capablity

Wintech has 20 years of experience in researching and China PCB manufacturing. We provide an extensive range of high-tech prototypes, including HDI boards (5+N+5, stack via and resin plug, laser drill in-house), multilayer boards (up to 70 layers) and rigid-flex boards, along with China electronics manufacturing services.

We also use special materials, mostly from Rogers, Teflon, Nelco, Getek, BT and Arlon.Monthly Turnout Reaching 350,000 Square Feet,With a 12,000-square-meter factory, more than 800 skilled employees and advanced equipment, we are able to produce 350,000 square feet of PCBs monthly. Our facilities house a Hitachi CO2 laser drill machine, X-ray target hole drill machine, AOI machine, Tektronix impedance measurement machines, XY-Dimension micro-test machines and ionic contamination testers. These allow us to complete a 70-layer prototype in as fast as two weeks.Meeting ISO, UL and RoHS Standards,Our QC procedures are in line with ISO/TS 16949, ISO 13485, ISO/TS 14067 and ISO 14001 standards. This ensures that our products carry UL and RoHS marks. Our R&D center consists of experienced engineers who are committed to high-tech PCB innovation.

From the in house qualification of advanced laminate materials, signal integrity analysis, DFx, Wintech is the leading manufacturer of advanced China PCB boards. For both high speed and high reliability China Printed Circuit Boards Assembly fabrication, Wintech will work with global based customer to develop advanced PCBs with unique requirements.

Multi layer Rigid PCB

Complex multi layer PCB processing leadership has been a core Wintech competency for over 15 years. We invest continuously in innovation, capital equipment, and engineering expertise to enhance our technology capacity and capability. Wintech offers early prototypes for New Product Introduction (NPI) to high volume Mass Production. We do all this within the same qualified China PCB manufacturing operations, guaranteeing scalability with optimized cycle times in the quantities your business requires.

Our rigid PCB mass production capabilities include:

The industries broadest offering of material types:

Blind and Buried mechanical and microvia technologies.

High-Density Interconnect (HDI) utilizing stacked microvia.

High Layer Count Constructions.

High-Speed / Ultra Low-Loss Materials.

Thermal Solutions with Attached or Embedded Copper Coins.

RF Materials and various in-lay or hybrid build-ups.

Cavity and Recessed Milling.

Back-drilling.

Epoxy filled Via in Pad Plated Over (VIPPO).

High-Density Interconnect HDI PCB Boards

HDI Printed Circuit Boards

High-Density Interconnects (HDI) process technology has continually evolved into PCB designs since its initial introduction in semiconductor package modules in the late 1980s. Today, drilling laser control depth blind µVias into a variety of laminates, utilizing a variety of copper plating processes, has become the dominant method of HDI fabrication. Wintech's extensive qualification methodology assures the reliability of complex µVia structures in a range of laminates that are thermally robust to multiple SMT reflow cycles. Our Material and HDI development road maps are focused on continuous feature size reduction for µVias, which is essential for today's cost-sensitive designs.

Wintech has been a leader in HDI interconnect innovation and mass production for over fifteen years. All of our factories have mass production capacity for µVia-based HDI processing, combined with fine line copper trace formation by semi-additive or subtraction copper plating.

Microvia

Wintech is one of the first companies to provide volume HDI capability to our global customers. Our continuous investment in developing processes for world-class fine-line µVia technology helps us maintain our position as a leader in sophisticated HDI manufacturer. We provide complete solutions to our customers by early design reviews to help eliminate potential cost or yield challenges, shortening NPI and production cycle times, and delivering reliable, high-quality products in the most cost-effective ways.

Every Layer InterConnect ELIC PCB Boards

For more than a decade, Wintech has continuously innovated next-generation µVia technologies. As the conventional laser via plating technology reached its limits, the Every Layer Interconnect (ELIC) process flow was developed in Wintech China and Germany R&D Labs. Also know as, Any Layer Technology, Wintech's ELIC process was launched into production in 2006. Innovations in laser µVia drilling, copper plating, direct imaging of resists and masks, and improved registration techniques have helped continually refined Wintech's state-of-the-art mass production facility in Zhuhai, China.

Today, Wintech boasts the capabilities for up to 18+ layers of vertically-stacked and copper-filled µVias. Combined with additional innovations in 0.3 mm fine-pitch package support, edge plating, and active cavity structures, Wintech offers our customers the flexibility to meet any design challenges. These integrated processes are critical to the thin, high-density assemblies required in the smartphone, computing, IoT devices, modules, and many other products.

Wintech is ready to provide you with end-to-end engineering and production services to bring your next-generation product PCB requirement seamlessly from NPI to mass production with world-class cycle times.

Flexible Circuits

Flexible printed circuits offer dynamic mechanical solutions for electrical interconnect strategies that cannot be achieved with conventional rigid China PCB boards. With decades of mass production experience, Wintech is an industry leader in China PCB fabrication and component assembly for flexible printed circuits.

Our annual production exceeds millions of square feet of single, double-sided, multi layer, and rigid-flex circuitry capacity. We process a wide variety of flexible materials and can rapidly customize solutions to meet our customer's growing requirements.

Single and Double Sided Circuits

Single & Double Sided Circuits Single & Double Sided Circuits

Single and double-sided flexible printed circuits from Wintech are utilized in a wide variety of China electronic assembly from simple antennas to complex control circuitry. The single and double-sided flexible circuits are produced using: adhesive based polyester ("PET"/"PEN") or polyi mide (PI) film substrates with copper thicknesses ranging from 18 um to 140 um. These circuits can be provided in single pieces, multiple up arrays, or in rolls.

Key Capabilities:

Single or double-sided circuitry.

Adhesive-based and adhesiveness constructions.

PI film substrates.

Low-cost, Roll-to-Roll manufacturing.

Fine line copper etch conductors.

Photo image able solder masks.

Laminated cover lay dielectrics.

Surface finishes include:

- OSP.

- Immersion Silver.

- Immersion Tin.

- Electroplated Nickel Gold.

- ENIG.

- ENEPIG.

Various support materials can be selectively added, including:

- Metal heat sinks.

- Film stiffeners.

- Metal, FR4, and CEM1 stiffeners.

- Release Films.

- EMI shielding.

- Molded plastic assemblies.

Multi-Layer Flexible

Mulltilayer FPC provides flexibility, and cost-effective alternative to flat cable and expensive connector integration approaches. Utilizing multilayer flexible printed circuits where each layer is produced using adhesive and adhesiveless type polyimide (PI) film substrates bonded together, with or without airgaps for conformal installation. Copper thicknesses ranging from 18um to 140um. Conventional plated hole or µVias, plus coverlay and flexible LPI solder mask circuit protection, are available.

You can choose final-tested circuits in single pieces or multiple up arrays, with lead-free re flowed SMT. These include component solder attachments on single or double-sided circuit sections with adhesive-attached stiffeners.

Key Capabilities:

Multilayer circuitry-from 3 to 16 layers

Adhesive-based and adhesiveless constructions

PI film substrates

Fine line copper etch conductors

Photo imageable solder masks

Laminated coverlay dielectrics

Surface finishes include:

- OSP

- Immersion Silver

- Immersion Tin

- Electroplated Nickel Gold

- ENIG

- ENEPIG

Various support materials can be selectively added, including:

- Metal heatsinks

- Film stiffeners

- Metal, FR4, and CEM1 stiffeners

- Release Films

- EMI shielding

- Molded plastic assemblies

Rigid-Flex Circuits

Rigid Flexible Circuits have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.

Wintech provides advanced integration of high volume rigid board technologies with sophisticated integrated flex circuit layering. Through Wintech's engineering of materials and China PCB fabrication processes, we offer exceptional mass production capability and capacity whether a consumer device, automotive, industrial, medical, or high-speed telecommunications, Wintech has a fully-qualified solution.

Standard Rigid-Flex

Standard Rigid-Flex provides a cost-effective alternative to rigid Printed Circuit Board (PCB) modules and Flexible Printed Circuit (FPC) interposers/connector systems. Wintech integrates conventional plated through-hole, and microvia interconnect processing for intermediate component density designs to give you the best Standard Rigid-Flex solutions. Wintech incorporates stiffeners, air gap construction, shielding, and coverlays from our FPC systems as needed.

With qualified materials from our matrix of low-cost, Asia-sourced rigid and FPC laminates, coverlays, stiffeners, and shielding, Wintech provides end-to-end solutions optimized for cost-sensitive applications. Wintech offers engineering support during the design and specification phase, to create an optimal bill of materials and stack-up to deliver low cost, high processing, and assembly yields, and the best reliability.

HDI Rigid-Flex

Wintech provides industry-leading HDI capabilities to optimize today's challenging designs. The use of HDI and Every Layer Interconnect (ELIC) stacked copper filled µVias, fine feature etching, and precision registration provide unique, mass-production solutions for complex designs.

With extensive investments in leading-edge production systems, rigid HDI PCB Wintech can build the next generation of interconnect solutions.

Rigid-Flex designs utilizing HDI/ELIC capabilities eliminate the need for the module connectors and saves precious space within the slim, high-style designs compact designs. Wintech provides this new end-to-end solution from initial design to mass production. Our Global Engineering, ITC, and Business teams are ready to help you quickly transform ideas into new interconnect platforms that achieve mass-production scale.

Semi-flex circuits

Semi-flex circuits have become a preferred design solution for cost-effective three-dimensional product assembly. Wintech provides the industry-leading expertise to integrate high-volume rigid board technologies with flexible circuit capabilities on standard material sets.

Features

No dielectric damage in the bend area

Tight dielectric thickness control in the bend area

Inner or outer bending layer

Solder mask or coverlay can cover bend area

Applications

Flex-to-install application

Limited bending cycles

Large bending radius

Thermal Management

Thermal challenges are growing concerns with today's designs. From component density issues, reduced thermal paths, and increase power amplification, these present challenges to help dissipate heat within the design of the China Printed Circuit Boards Assembly. To help minimize these issues, Wintech provides a broad suite of innovative thermal management solutions.

Through the use of embedded heat transfer techniques, Wintech can offer processes for solid-plated µVia arrays, embedded metal structures ("Coins"), both flush mounted or cavity recessed, and surface-attached heat transfer media. These technologies offer a wide range of thermal dissipation within the PCB, and Wintech engineering has industry-leading expertise in thermal solutions.

Thru-Hole Via Farm

Utilizing dense via formations can help improve thermal dissipation from the component side to the backside of the PCB. Wintech can provide increased redundant via structures in both thru-hole, and µVia deigns.

COIN

For enhanced heat dissipation in power amplifier boards, network products customers are designing with “COINS” technologies into high ASP 10-16 layer count PCBs. Three different copper COINS technologies have been setup in Wintech China.

Inlay

In response to new system performance demands in the wireless infrastructure market, Wintech introduced our first inlay Printed Circuit Board (PCB) technology in 2012. In prior product applications, a full panel FR4 material is applied in hybrid stack-up construction with an entire panel core of expensive high frequency yet low loss material, resulting in an expensive finished product.

To reduce total panel cost, Wintech introduced selective semi-finished inlay circuitry using high-frequency laminate, into the overall FR4 laminate panels using 3D structuring. With only a small part of the final PCB design area specified for high-frequency signal transfer, our inlay innovations reduce the amount of high-frequency laminate and allow integration of our thermal solutions into your final optimized design. A full design guide is available upon request.

Reliability

Wintech is committed to providing products that meet or exceed your specifications. To accomplish this requirement, we conduct a broad range of reliability tests at every stage. From raw materials qualification through final lot compliance testing before shipment. In addition to this array of qualification tests, we maintain a set of test systems in our Interconnect Technology Center, which allows us to simulate your product assembly conditions and long-term exposure to power cycling or environmental conditions. Wintech engineering can recommend a test series that provide confidence to meet or exceed any reliability requirement.

Detail of Analysis include:

Material & Process Characterization

Emerging technology Evaluation

Variation Reduction

Failure Analysis

Reliability

Lifecycle Testing

Signal Integrity

Wintech China PCB boards manufacturing capability and lead time as below:

Wintech China PCB boards Plants Basic Info:

• Multoc Circuit Co.,Ltd. Established in year 1995 And 100% Subsidiary Company is Invested By Wintech

• Factory Location: Multoc Building Park,Futian Industrial Zone, Dingnan City, Jiangxi Province,China.
• Initial Capital of $9,000,000
• Accredited ISO9001 ISO13485 ISO 16949 ISO14000
• Factory production area of over 12000m2
• Over 800 employees
• Sales Revenues: 120 Million USD with 2019 year
• Pcb design & layout,manufacturing, China PCB boards serviced for China PCB manufacturing a wide range of products including: Automotive, industrial, medical, consumer, telecom, and Aerospace Devices

• Pcb include: Multilayer Rigid Pcb, HDI Pcb, Over 70 Layer, And Flexible Circuits Pcb, Rigid-Flexible Circuits Pcb.
• Products are 100% exported from China, primarily to Europe and North America.

Contact Wintech: Email: sales@wintechele.com Tel: +86-755-23177710 MP: +8613530878512